Descargar Liquid Cooling (Thermal Management of Microelectronic and Electronic System Series) de Incropera PDF ePub
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Liquid Cooling (Thermal Management of Microelectronic and Electronic System Series) de Incropera
Descripción - Reseña del editor Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems. Biografía del autor Frank P. Incropera is an American mechanical engineer and author on the subjects of mass and heat transfer. Incropera is the Clifford and Evelyn Brosey Professor of Mechanical Engineering at the University of Notre Dame, Indiana, US.
Detalles del Libro
- Name: Liquid Cooling (Thermal Management of Microelectronic and Electronic System Series)
- Autor: Incropera
- Categoria: Libros,Ciencias, tecnología y medicina,Tecnología e ingeniería
- Tamaño del archivo: 16 MB
- Tipos de archivo: PDF Document
- Idioma: Español
- Archivos de estado: AVAILABLE
Descargar PDF Liquid Cooling (Thermal Management of Microelectronic and Electronic System Series) de Incropera PDF [ePub Mobi] Gratis
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Liquid Cooling Technology - Mentor Graphics ~ Liquid Cooling Technology Leveraging FloTHERM to design a Compact Liquid Cooling System for High Power Microelectronic Devices. By Gongyue Tang,Yong Han, Boon Long Lau, Xiaowu Zhang, and Daniel Min Woo Rhee, Institute of Microelectronics, Agency for Science, Technology and Research, Singapore
Thermal Management of Microelectronic Equipment - ASME ~ In the cooling of electronic equipment, liquid cooling is frequently applied to high—heat dissipation electronic equipment. The reason is that the liquid has better heat transfer properties than that of the gas. Liquid cooling can further be divided into single- and two-phase systems.
Electronics Cooling: Thermal Management Approaches and Principles - ATS Webinar Series ~ A leading-edge engineering and manufacturing company focused on the thermal management of electronics. Service, Products and Training • Cooling Solutions – From Chip to System
An Overview of Liquid Coolants for Electronics Cooling ~ In the future, coolants with better properties (thermal conductivity, specific heat, thermal stability) may be available, but their popularity will depend on their reliability and economics. References. Incropera, F., Liquid Cooling of Electronic Devices by Single-Phase Convection, New York: John Wiley & Sons, 1999, pp. 1-14.
Liquid cooling fundamentals for high - Electronic Products ~ Designing a liquid cooling solution for a TV transmitter module or any other type of heat-producing electronic device is a fairly straightforward exercise with one exception: Liquid cooling brings non-dielectric coolants into proximity with electrical components — where any leak, no matter how small, is likely to have dire consequences.
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Electronics Thermal Management in Information and ~ ‘hybrid’ thermal management solutions employing a combination of air cooling and liquid cooling at the server level are being gradually introduced for high-end computing facilities. In a hybrid air/liquid cooled server, only the components with the highest heat loads such as processors are liquid cooled.
Thermal Design of Liquid Cooled Microelectronic Equipment ~ The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analog devices. This book provides a comprehensive review and overview of all liquid cooling technologies as well as their applications to commercial products in industry.
Thermal Management of Microelectronic Equipment - ASME ~ They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
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Thermal management of high power dissipation electronic ~ Abstract: Performance-driven electronic packaging demands for thermal solutions of high power dissipation such as enhanced air cooling or, alternatively, liquid cooling technologies. This paper reports the characterization of air-cooled vapor chamber heat sink (VCHS) and liquid cooled heat sinks (LCHS) for electronic packages with a targeted power dissipation of 140W.
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Liquid Cooling Systems - Digi-Key ~ to Liquid Cooling Systems Thermal management of electronic components and systems is more challenging than ever. Power densities continue to increase, while product form factors continue to shrink. Engineers must now consider thermal management early on in the product development cycle to make sure sufficient space
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Coolingzone - Direct liquid immersion cooling for high ~ direct liquid cooling, the focus of this article, may also be termed direct liquid immersion cooling, since there are no physical walls separating the microelectronic chips and the surface of the substrate from the liquid coolant. this form of cooling offers the opportunity to remove heat directly from the chip(s) with no intervening thermal conduction resistance, other than that between the .
COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL ~ Cooling Microelectronic Devices Using Otimal Microcannel Heat Sins Rev.IA.sc.Ing.Antioq / scuela de Ingeniera de Antioquia objetivo se obtuvo con el criterio de la mínima generación de entropía. En este estudio, se definió la geometría del microcanal, la cantidad de calor a ser retirado y las propiedades del fluido de trabajo.
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